| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermocouple mounting structure easy for mounting thermocouple, and difficult to displace the thermocouple from its measuring point, while keeping insulation between respective wires of the thermocouple sufficiently, in a ceramic heater provided with a thermocouple, such as a die bonding heater or the like used for mounting a semiconductor chip on a substrate. SOLUTION: The thermocouple mounting structure comprises a ceramic heater having a heating element buried therein, and a ceramic dielectric plate having a thermocouple fixed thereto. A slit that passes through near side of the buried heater is formed on the surface of the ceramic heater. The thermocouple comprises two thermocouple wires and a tip joint connecting the wires. The two wires are separated, and fixed to the dielectric plate. The ceramic dielectric plate is fixed in the slit as the tip joint of the thermocouple contacts to the vicinity of the heating element buried under the slit. COPYRIGHT: (C)2005,JPO&NCIPI
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