| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation film-forming material forming a coating film having proper and uniform thickness as interlayer insulation films of semiconductor elements, excellent in heat stability, hardly generating cracks and excellent in dielectric constant characteristics. SOLUTION: The insulation film-forming material contains a polymer (A) having a repeating unit expressed by general formula (I) (wherein two or more R<SB>1</SB>s may be the same or different, express each a monovalent hydrocarbon group or a monovalent group convertible to a hydrocarbon group through a Diels-Alder reaction and a successive elimination reaction, or a group in which a part of carbon atoms in the monovalent hydrocarbon group are substituted with silicon atoms, or a group in which a part of carbon atoms in a monovalent group to be a hydrocarbon group through the Diels-Alder reaction and the successive elimination reaction are substituted with silicon atoms; n expresses 1-10). COPYRIGHT: (C)2005,JPO&NCIPI
|
