发明名称 |
REINFORCING ELEMENT, AND METHOD FOR MACHINING SUBSTRATE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for etching a substrate after reinforcing the substrate, and also to provide a reinforcing element for reinforcing the substrate. SOLUTION: The reinforcing element is used in a process for etching the substrate 1 after reinforcing the substrate 1. A sticking plate 3 is integrated with the substrate 1 via a sticking agent 2, which has fluidity and has been spread on the substrate 1. The sticking plate 3 is formed so as to have one or more through holes 4 thereon. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004291172(A) |
申请公布日期 |
2004.10.21 |
申请号 |
JP20030088534 |
申请日期 |
2003.03.27 |
申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
NIWA TAKASHI;CHIBA TOKUO;OKA KAZUNARI;ICHIHARA SUSUMU |
分类号 |
B81C1/00;(IPC1-7):B81C1/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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