发明名称 REINFORCING ELEMENT, AND METHOD FOR MACHINING SUBSTRATE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a method for etching a substrate after reinforcing the substrate, and also to provide a reinforcing element for reinforcing the substrate. SOLUTION: The reinforcing element is used in a process for etching the substrate 1 after reinforcing the substrate 1. A sticking plate 3 is integrated with the substrate 1 via a sticking agent 2, which has fluidity and has been spread on the substrate 1. The sticking plate 3 is formed so as to have one or more through holes 4 thereon. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004291172(A) 申请公布日期 2004.10.21
申请号 JP20030088534 申请日期 2003.03.27
申请人 SEIKO INSTRUMENTS INC 发明人 NIWA TAKASHI;CHIBA TOKUO;OKA KAZUNARI;ICHIHARA SUSUMU
分类号 B81C1/00;(IPC1-7):B81C1/00 主分类号 B81C1/00
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