发明名称 PROCESS FOR FABRICATING MICROMACHINE
摘要 <p>A process for fabricating a micromachine in which removal of a sacrifice layer and sealing can be carried out without requiring any special packaging technology. The process for fabricating a micromachine (1) equipped with an oscillator (4) comprises a step for forming a sacrifice layer around the movable part of the oscillator (4), a step for covering the sacrifice layer with an overcoat film (8) and making a through opening (10) communicating with the sacrifice layer through the overcoat film (8), a sacrifice layer etching step for removing the sacrifice layer through the use of the trough opening (10) in order to form a space around the movable part, and a step for sealing the trough opening (10) by performing film deposition while reducing the pressure following etching of the sacrifice layer.</p>
申请公布号 WO2004089812(A1) 申请公布日期 2004.10.21
申请号 WO2004JP04822 申请日期 2004.04.02
申请人 SONY CORPORATION;MITARAI, SHUN;TADA, MASAHIRO;KINOSHITA, TAKASHI;TANAKA, MASAHIRO;YAMAGUCHI, MASANARI;NANIWADA, KOJI 发明人 TADA, MASAHIRO;KINOSHITA, TAKASHI;TANAKA, MASAHIRO;YAMAGUCHI, MASANARI;MITARAI, SHUN;NANIWADA, KOJI
分类号 B81B3/00;B81C1/00;B81B7/00;H03H3/007;H03H9/24;(IPC1-7):B81C1/00 主分类号 B81B3/00
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