<p>A process for fabricating a micromachine in which removal of a sacrifice layer and sealing can be carried out without requiring any special packaging technology. The process for fabricating a micromachine (1) equipped with an oscillator (4) comprises a step for forming a sacrifice layer around the movable part of the oscillator (4), a step for covering the sacrifice layer with an overcoat film (8) and making a through opening (10) communicating with the sacrifice layer through the overcoat film (8), a sacrifice layer etching step for removing the sacrifice layer through the use of the trough opening (10) in order to form a space around the movable part, and a step for sealing the trough opening (10) by performing film deposition while reducing the pressure following etching of the sacrifice layer.</p>
申请公布号
WO2004089812(A1)
申请公布日期
2004.10.21
申请号
WO2004JP04822
申请日期
2004.04.02
申请人
SONY CORPORATION;MITARAI, SHUN;TADA, MASAHIRO;KINOSHITA, TAKASHI;TANAKA, MASAHIRO;YAMAGUCHI, MASANARI;NANIWADA, KOJI
发明人
TADA, MASAHIRO;KINOSHITA, TAKASHI;TANAKA, MASAHIRO;YAMAGUCHI, MASANARI;MITARAI, SHUN;NANIWADA, KOJI