| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for the high frequency, which can prevent warping and cracking of the package for the high frequency, and in which the transmission of the high frequency signal at the connection part of a conversion substrate and an electronic component for the high frequency is excellent. <P>SOLUTION: A connection terminal 9 is composed of a line conductor 7 for the high frequency, which is arranged adjacently to a mounting part 2 and which is extended to the central part from the outer peripheral part on the upper face of a dielectric substrate 6, and a grounding conductor 8 to the same surface arranged close to the line conductor 7 for the high frequency. The connection terminal 9 is formed to a metal substrate 3 having the mounting part 2 of the electronic component 1 for the high frequency on its upper face. A frame-like grounding conductor 10 is formed on the lower face of the dielectric substrate 6. A slot 11, which is electrically coupled with the end on the central part side of the line conductor 7 for the high frequencies is provided in an internal grounding conductor 12. The internal grounding conductor 12 is formed between the end on the central part side of the line conductor 7 for the high frequency inside the dielectric substrate 6 and the frame-like grounding conductor 10. The conversion substrate 15 is mounted, in which the grounding conductor 8 to the same surface is connected with the internal grounding conductor 12 and a first connection conductor 13, and the frame-like grounding conductor 10 is connected with the internal grounding conductor 12 and a second connection conductor 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
