发明名称 WIRING BOARD FOR HOUSING ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board for housing an electronic component having an inductor built therein capable of reducing variations in the electrical characteristics of the inductor and having a high Q value. <P>SOLUTION: The wiring board for housing an electronic component comprises an insulating substrate and the inductor. The insulating substrate is formed by stacking a second frame of a dielectric layer 1, a first frame of dielectric layers 2, 3, and a bases of dielectric layers 4, 5. The inductor is formed by electrically connecting substantially-the same shaped, railtrack-like conductors 9, 10 arranged on lower and upper surfaces of the first frame and on at least two surfaces between the dielectric layers 2 and 3 respectively. In the first frame, since a lamination shift between the railtrack-like conductors can be made small, variations in electrical characteristics of the inductor can be suppressed. Since the inductor can be spaced from a ground electrode 6, the built-in inductor can have a high Q value. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004296927(A) 申请公布日期 2004.10.21
申请号 JP20030089271 申请日期 2003.03.27
申请人 KYOCERA CORP 发明人 YAMAMOTO SHUICHI
分类号 H01F17/00;H01L23/02;H01L23/12;H05K3/46;(IPC1-7):H01L23/02 主分类号 H01F17/00
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