| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink which can maintain high junction reliability even when the sink is placed under a temperature cycle when the sink is used, and to provide a power module, a method of manufacturing the heat sink, and a method of manufacturing the power module. SOLUTION: The power module 10 is provided with an insulating circuit board 18 having an insulating substrate 14, the heat sink 17 provided on one surface of the circuit board 18, and a semiconductor chip 13 provided on the other surface of the circuit board 18. The insulating circuit board 18 is provided with a metallic layer 16 formed on one surface of the insulating substrate 14 and the heat sink 17 is provided with a main body 21 constituting at least the contacting surface with the insulating circuit board 18. The main body 21 of the heat sink 17 and metallic layer 16 are formed of pure Al, an Al alloy, pure Cu, or a Cu alloy. The heat sink 17 is joined to one surface of the insulating circuit board 18 through an intermetallic compound layer 19 containing Sn and Ni. COPYRIGHT: (C)2005,JPO&NCIPI |
