| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which hardly causes chip shifting in a thin, surface-mounted package and is excellent in reflow crack resistance and void resistance, and an electronic component device equipped with an element sealed with the same. SOLUTION: The epoxy resin molding material for sealing essentially comprises (A) an epoxy resin, (B) a hardener, (C) a hardening accelerator and (D) a filler and has a viscosity measured by SDR of≤100 Pa s. The electronic component device is equipped with the element sealed with the epoxy resin molding material. COPYRIGHT: (C)2005,JPO&NCIPI |
