Electrolytic processing apparatus and substrate processing apparatus and method

摘要

The present invention alleviates workloads in chemical-mechanical polishing (CMP) by replacing all or a portion of the substrate processing by means of chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like and enables processing insuring the higher flatness with the higher efficiency. The electrolytic processing apparatus according to the present invention comprises a chemical-mechanical polishing section 24 for chemically-mechanically polishing a surface of a substrate of a substrate, an electrolytic processing section 26 having a processing electrode and a feeding electrode and also having an ion exchanger 48 provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode for electrolytically processing a surface of a workpiece under the existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring 74 capable of freely moving between the chemical-mechanical polishing section 24 and the processing electrode section 26.