发明名称 |
Method for electrical testing of semiconductor package that detects socket defects in real time |
摘要 |
An electrical testing method for a semiconductor package for detecting defects of sockets mounted on a device under test (DUT) board is provided. A tester performs electrical test, accumulates electrical test results, and compares the accumulated results to reference values. The result of the comparison decides whether a plurality of sockets mounted on the DUT board can be used or not. The decision results are transmitted to a handler so that the socket having the defects is not used on the DUT board.
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申请公布号 |
US2004207387(A1) |
申请公布日期 |
2004.10.21 |
申请号 |
US20040824220 |
申请日期 |
2004.04.13 |
申请人 |
CHUNG AE-YONG;KIM SUNG-OK;BANG JEONG-HO;SHIN KYEONG-SEON;CHI DAE-GAB |
发明人 |
CHUNG AE-YONG;KIM SUNG-OK;BANG JEONG-HO;SHIN KYEONG-SEON;CHI DAE-GAB |
分类号 |
G01R31/26;G01R31/02;G01R31/28;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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主权项 |
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