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发明名称
半导体评估装置及半导体评估方法
摘要
本发明系提供可以形成高测定精度以及测试重现性之半导体评估装置以及半导体评估方法。其具有输出为在半导体晶圆中激起光载子而调制之抽运光之抽运雷射、向半导体晶圆照射探针光之探针雷射及检测由半导体晶圆所反射之探针光之检测器。
申请公布号
TW200421460
申请公布日期
2004.10.16
申请号
TW093109303
申请日期
2004.04.02
申请人
东芝股份有限公司
发明人
坏晴子;力丸胜实;须黑恭一;岛龙哉;川濑吉正;村越笃
分类号
H01L21/26
主分类号
H01L21/26
代理机构
代理人
陈长文
主权项
地址
日本
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