| 摘要 |
PURPOSE: An acid copper electroplating solution is provided which is capable of filling copper in through holes and via holes of printed circuit board having wiring structure of micron scale without defects such as void, inclusion and seam. CONSTITUTION: The acid copper electroplating solution comprises one or more of polishes selected from bis-(sodium sulfopropyl)-disulfate, 3-mercapto-1-propane sulfonic acid, 2-amino-5-(methylthio)-1,3,4-tridiazole and Janus green B as an acid copper plating composition comprising an aqueous solution of acid and copper salt, wherein the acid copper electroplating solution further comprises polyethylene glycol, cross-linked polyamide or both thereof as an inhibitor, wherein the acid copper electroplating solution further comprises alkoxylated beta-naphthol as a carrier, and wherein the acid copper electroplating solution further comprises polyethylene glycol tert-octylphenyl ether as a surfactant.
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