发明名称 COMPOSITION FOR DEPOSITING METAL LAYER AND METHOD FOR FORMING METAL LAYER USING THE SAME TO IMPROVE STEP COVERAGE
摘要 PURPOSE: A composition for depositing a metal layer and a method for forming a metal layer using the same are provided to improve a step coverage by forming a cobalt layer of high purity. CONSTITUTION: A composition for depositing a metal layer includes an organic transition metal compound precursor and a carrier gas of 1 to 39 parts by volume, and hydrogen of 1 to 399 parts by volume. In the composition, the organic transition metal compound precursor and the carrier gas corresponds to 1 to 5 parts by volume and the hydrogen corresponds to 1 to 59 parts by volume. The organic transition metal compound precursor has cobalt-cobalt bonds.
申请公布号 KR20040088110(A) 申请公布日期 2004.10.16
申请号 KR20030022123 申请日期 2003.04.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, GIL HYEON;KANG, SANG BEOM;KIM, HYEON SU;MUN, GWANG JIN;YANG, SEUNG GIL
分类号 C23C16/16;H01L21/285;H01L21/768;(IPC1-7):H01L21/285 主分类号 C23C16/16
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