INTEGRATED CIRCUIT DIE AND/OR PACKAGE HAVING A VARIABLE PITCH CONTACT ARRAY FOR MAXIMIZATION OF NUMBER OF SIGNAL LINES PER ROUTING LAYER.

摘要

An integrated circuit die and/or package. An apparatus is described having a substrate with a central region and an outer region. A first plurality of electrical connections is spaced apart by a first distance on the outer region of the substrate. A second plurality of electrical connections is spaced apart by a second distance, smaller than the first distance, on the central region of the substrate.