| 摘要 |
A vacuum pump 16 depressurizes a scavenging chamber 5 to discharge the air or gas residing in a via hole 21. Then, a paste chamber 9 provided adjacent to the scavenging chamber 5 moves on the scavenged via hole 21. A squeezing unit 6 provided in the paste chamber 9 pushes a conductive paste 13 into the via hole 21. Keeping the inside space of the via hole 21 in a depressurized condition is effective to let the conductive paste 13 enter deeply into the via hole 21. The inside space of the via hole 21 is entirely filled with the conductive paste 13.
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