发明名称 WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board which is capable of effectively preventing fractures from occurring in a low-melting brazing material which bonds a connection pad of an insulating base to a circuit interconnecting wiring of an external electric circuit board, and electrically connecting the electrodes of a semiconductor element or the like mounted on a wiring board to an external electric circuit securely and firmly for a long period of time. <P>SOLUTION: The wiring board is composed of an insulating base 1 which is formed of electric insulating material and equipped with a semiconductor element mounting part 1a on its surface, a large number of connection pads 6 formed on the undersurface of the insulating base 1, and a plurality of wiring conductors 2 which are derived from the mounting part 1a extending to the connection pads 6. The connection pads 6 are each composed of a main connection part 6a which is formed on each bottom center of a large number of recesses 7 formed on the undersurface of the insulating base 1, and an auxiliary connection part 6b formed on the internal surface of the recess 7. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004288736(A) 申请公布日期 2004.10.14
申请号 JP20030076340 申请日期 2003.03.19
申请人 KYOCERA CORP 发明人 MATSUDERA HIROSHI
分类号 H05K1/11;H01L23/12;H01L23/13;H05K1/02;H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K1/11
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