| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip chip gold bump structure and a method for manufacturing the same. <P>SOLUTION: A flip chip gold bump structure comprises a nickel layer on a gold bump formed on a chip and a copper layer on the nickel layer, to form a Ni/Cu barrier layer. The Ni/Cu barrier layer obstructs interaction between the gold bump and a solder. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
