| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has an excellent solder resistant characteristic that does not cause peeling from a lead frame even on solder treatments after absorption of moisture, and a semiconductor device. SOLUTION: The epoxy resin composition for semiconductor sealing comprises (A) an epoxy resin, (B) a phenolic resin, (C) a hardening accelerator, (D) an inorganic filler, and (E) a thiazoline-based compound, more preferably a thiazoline compound represented by formula (1). In the formula, R1 and R2 are each a hydrogen, an amino group, a mercapto group, a hydroxy group, or an organic group containing them and may be the same with or different from each other, with the proviso that R1 and R2 are not simultaneously hydrogen and a compound containing a four or more-membered ring structure besides thiazoline ring is excluded. COPYRIGHT: (C)2005,JPO&NCIPI |
