发明名称 METHOD AND APPARATUS FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To prevent sulfur residue and particles from remaining on the surface of a substrate after treatment with a mixture of sulfuric acid and hydrogen peroxide solution. SOLUTION: In a method of treating substrate, after a resist film was peeled from the surface of the substrate by using the mixture of sulfuric acid and hydrogen peroxide solution, a soft spraying of SC1 (NH<SB>4</SB>OH+H<SB>2</SB>O<SB>2</SB>+H<SB>2</SB>O) is performed, and supplying a jet of droplets of SC1 is performed to the surface of the substrate. Alternatively, after a resist film was peeled from the surface of the substrate by using the mixture of sulfuric acid and hydrogen peroxide solution, ultrasonic vibration is given to the SC1, and the SC1 that has been given ultrasonic vibration is supplied to the surface of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004288858(A) 申请公布日期 2004.10.14
申请号 JP20030078644 申请日期 2003.03.20
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 OKAMOTO TADAO;OKUYA YOSUKE;SUGAWARA YUJI
分类号 G03F7/42;H01L21/027;H01L21/304;(IPC1-7):H01L21/304 主分类号 G03F7/42
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