发明名称 METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To manufacture a thin-film multi-layered type laminated ceramic electronic component which has high reliability by deterring structural defects such as inter-layer peeling and a short circuit. SOLUTION: When ceramic slurry to form a ceramic green sheet with a specified thickness through coating and drying is manufactured (s1), the content rate of resin consisting of an organic binder and a plasticizer to the ceramic slurry is set within a specified range according to the thickness of a ceramic layer formed by sintering the ceramic green sheet. Consequently, the ceramic layer has proper hardness and adhesive strength, so structural defects such as a short circuit and inter-layer peeling are deterred when the ceramic green sheet is heat pressed (s5) and a raw body is sintered (s7). Further, a ceramic sinter increases in strength, so high-temperature load life is improved. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004289090(A) 申请公布日期 2004.10.14
申请号 JP20030082530 申请日期 2003.03.25
申请人 MURATA MFG CO LTD 发明人 MATSUDA MAKOTO;NAKAGAWA KIYOSHI
分类号 H01G4/12;C04B35/622;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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