| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board which eliminates the need of a quick etching process for removing an unnecessary part of a foundation metallic layer while using a plating method, and can supply electric power even by a continuous transfer type method. SOLUTION: The manufacturing method of a printed wiring board for forming a metallic wiring pattern by a plating method on an insulating substrate comprises a process for forming a photoresist mask pattern for forming a metallic wiring pattern on the insulating substrate by plating, a process for forming a metallic film all over the insulating substrate with the photoresist mask pattern, a process for removing the metallic film excepting that for conduction on the photoresist mask pattern surface while leaving a metallic film 8 in a portion excepting the photoresist mask pattern by half etching, a process for forming a metal plating film in a portion excepting the photoresist mask pattern by plating, and a process for peeling the photoresist mask pattern and forming a required metallic wiring pattern. COPYRIGHT: (C)2005,JPO&NCIPI
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