| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which the distance between the bonding wires is kept surely. <P>SOLUTION: A semiconductor device 18 is held in a resin tank filled with liquid UV-curing resin and the inside of the resin tank is irradiated with condensed light. The light condensed point is then shifted from a first connecting point 44a on a bonding wire 38a to a second connecting point 44b on a second bonding wire 38b. The bonding wires 38 are then connected through UV-curing resin 46 cured like a thread. Consequently, a semiconductor device 18 where the distance between the bonding wires is kept surely regardless of the distance between the bonding wires can be obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
