| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that an electronic component cannot be operated normally and stably because of adhesion of a solder material to the electronic component being contained or low reliability of hermetic sealing. SOLUTION: In a substrate 1 for mounting an electronic component having a part A for mounting an electronic component 3 and a square frame-like sealing metallize layer 6 surrounding the mounting part A formed on the upper surface of an insulating substrate 4, upper surface of the sealing metallize layer 6 is higher at the corner part than at the side part. COPYRIGHT: (C)2005,JPO&NCIPI
|
