| 摘要 |
PROBLEM TO BE SOLVED: To carry semiconductor wafers with a large degree of freedom in carriage while reducing the footprint of a system where a plurality of vacuum processing chambers are connected to the circumference of an airtight carrying chamber provided with a substrate carrying system. SOLUTION: First and second articulated arms of substantially identical structure turnable about the center of a carrying chamber are provided. Each articulated arm consists of a turning arm and a forward end arm for holding a wafer, and a middle stage arm provided between both arms. In an ordinary articulated arm where the substrate holding arm performs a linear motion, a gear ratio between a base end pulley of the turning arm and a supporting pulley on the forward end side is 2:1 and a gear ratio between a fixed pulley on the base end side of the middle stage arm and a forward end pulley on the forward end side is 1:2, but the former gear ratio is set at 2.67:1, for example. The substrate holding arms of the first and second articulated arms advance while drawing curves away from each other and make an open angle of 45°when the arms extend fully. COPYRIGHT: (C)2005,JPO&NCIPI
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