| 摘要 |
PROBLEM TO BE SOLVED: To provide a connecting structure of leads so as not to bring about a displacement between a package and an electronic cooler by the residual stress of the lead connected to the electronic cooler, and to prevent the short circuiting of the lead upon any vibration or impact. SOLUTION: This optical semiconductor element module includes an optical semiconductor element, the electronic cooler provided at the signal terminal at a lower part, a carrier solder connected to the upper surface of the electronic cooler, a connecting substrate formed separately from the carrier and connected to the upper surface of the electronic cooler, the package for housing the electronic cooler, a conductor wire connected to the connecting substrate and the package, and the leads for connecting the connecting substrate to the signal terminal of the electronic cooler. The leads 10a are connected on the pattern substrate 11 mounted on a Peltier 10 in a structure not to connect to the other component for forming an optical system. Even if the bending part of the lead 10a is released from a stress, the displacement of an LD2 and a lens 7 does not occur only by applying the stress to the pattern substrate lead 9a on the Peltier 10. COPYRIGHT: (C)2005,JPO&NCIPI
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