发明名称 METHOD FOR MEASURING DEGREE OF ETCHING
摘要 PROBLEM TO BE SOLVED: To provide a method and a device capable of exactly obtaining an etching degree during and/or after an etching process independently of an etching method of a material. SOLUTION: The method and the device for obtaining the etching degree of the material 25 by arranging detector elements 60 and 72 adjacently to a part of the material 25 to be etched are provided. The element widths W1 and W2 varies. The resistance of the detector element is measured during etching of a part. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004285477(A) 申请公布日期 2004.10.14
申请号 JP20040082377 申请日期 2004.03.22
申请人 HEWLETT-PACKARD DEVELOPMENT CO LP 发明人 BARNES TED W;CHAVARRIA VICTORIO;SUDYKA WILLIAM J;GHOZEIL ADAM;EMERY TIMOTHY R
分类号 B41J2/045;B41J2/055;B41J2/16;C23F1/02;C23F1/24;C23F4/00;G01N27/04;H01L21/306;H01L21/3065;(IPC1-7):C23F1/24 主分类号 B41J2/045
代理机构 代理人
主权项
地址