| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus which is suitable for performing deposition on a large-area substrate. SOLUTION: A plasma-generating part 10 generates surface wave-excited plasma P using an energy of a surface wave S transmitted across the surface of a dielectric plate 2. When a negative DC voltage or high-frequency power is applied to a target 5, component particles in the target 5 are sputtered by ions in the plasma P and deposited on the substrate 100. COPYRIGHT: (C)2005,JPO&NCIPI
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