| 摘要 |
PROBLEM TO BE SOLVED: To provide a roving prepreg which is good in handling property by having a low tackiness at near room temperature and has such a good moldability under a low pressure as giving sufficient adhesion between the layers without press-molding using an autoclave; and to provide an epoxy resin composition for the roving prepreg. SOLUTION: The roving prepreg is composed of a reinforcing fibrous material and a matrix resin, ensuring at least 50% interlayer adhesion area ratio and exhibiting at most 10 N peeling strength when it is molded at 80°C under pressure of 0.02 MPa. Wherein the matrix resin has viscosity of 2,000-100,000 (Pa×s) at 30°C and <20 (Pa×s) at 80°C, and is composed of the epoxy resin composition compounded with a reactive curing agent which reacts with an epoxy resin at room temperature and/or a latent curing agent which does not react with the epoxy resin at room temperature but reacts by heating. COPYRIGHT: (C)2005,JPO&NCIPI
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