| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method, a mounting structure, and a package board, which suppress warps on a thin film board to improve a product yield, and offer sufficient cooling capability when an LSI having a high calorific value is mounted on the board. <P>SOLUTION: According to the package board 1, an opening 11 is formed on a first board 12, which is laminated with the thin film board (second board) 13 to cover the opening 11 with the film board 13. Then, capacitors (first electronic components) 14 are inserted into the opening 11 and joined to the thin film board. Further, the opening 11 is filled with a resin 15 so that the resin has a thickness greater than a certain value, and the resin 15 is left hardening so that it supports the film board 13 and the capacitors 14. The LSI 16 (second electronic component), which is to be connected to the capacitors 14, is joined to an exposed one surface of the film board 13, and is connected to the capacitors 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
