| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for accommodating a light emitting element in which transparent resin can be bonded rigidly in a through hole of a frame, and to provide a light emitting device. <P>SOLUTION: The package for accommodating a light emitting element is formed by bonding a frame 2 for containing the light emitting element 3 thereinside to the upper surface of a substrate 1 having a part 1a for mounting the light emitting element 3 while surrounding the mounting part 1a. At a position on the inner circumferential surface of the frame 2 higher than the upper surface of the light emitting element 3, a level difference 7 having larger inner dimensions on the upper side of that position than on the lower side thereof is formed, and a groove 8 is formed at the lower end of the upper part of the level difference 7 toward the outer surface of the frame. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
