Leadless leadframe electronic package and IR transceiver incorporating same

摘要

A leadless lead frame electronic package (LLP) includes a lead frame of thermally-and-electrically conductive material encapsulated in an encapsulation of electrically-insulating material to define a planar mounting surface including an exposed web of encapsulation forming a portion of the planar mounting surface. The lead frame includes parallel internal and external planar surfaces with the external surface defining a recessed C-shaped channel therein for receiving the web of encapsulation. The external planar surface of the lead frame remains exposed through the encapsulation adjacent the web, with the web and the external planar surface adjacent the web extending generally co-planar with the mounting surface. The encapsulation is a transparent material forming a lens. The internal surface of the lead frame may include an attachment site for an optical component, with the lens being aligned with the attachment site for the optical component.