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经营范围
发明名称
Interconnect structure
摘要
An interconnect structure including a substrate, an interconnect device formed on the substrate, and a test device formed on the substrate.
申请公布号
US2004201016(A1)
申请公布日期
2004.10.14
申请号
US20040831663
申请日期
2004.04.23
申请人
LIEBESKIND JOHN
发明人
LIEBESKIND JOHN
分类号
G01R31/28;G01R1/04;G01R1/073;H01L21/66;H01L23/482;(IPC1-7):H01L23/58
主分类号
G01R31/28
代理机构
代理人
主权项
地址
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