| 摘要 |
This publication discloses an electronic module and a method for manufacturi ng an electronic module, in which a component (6) is glued (5) to the surface o f a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made fr om the conductive layer, to the surface of which the component (6) is glued.</S DOAB> |
