| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component packaging method capable of reducing thermal influence to other electronic components which have been already packaged at the time of heating for the packaging of a certain electronic component, a method of manufacturing electronic circuit boards and a packaging device for electronic components. <P>SOLUTION: The electronic component packaging method for packaging an electronic component on the circuit pattern through the bonding agent, is characterised in that, at the time of heating a bonding material existing between an electronic component to be packaged and a circuit pattern formed on a substrate 10, a heating prevention means for preventing the heating of an adjacent area which is adjacent to a packaging area of the electronic component to be packaged is applied. Concretely, a supporting member is attached to a supporting table 131 installed in a heat packaging unit 130 and a radiator brought into contact with the adjacent area of the substrate 10 is used as a part of the supporting member. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
