发明名称 Conductive material for integrated circuit fabrication
摘要 A conductive composition of titanium boronitride (TiBxNy) is disclosed for use as a conductive material. The titanium boronitride is used as conductive material in the testing and fabrication of integrated circuits. For example, the titanium boronitride is used to construct contact pads such as inline pads, backend pads, sensors, or probes. Advantages of embodiments of the titanium boronitride include reduced scratching, increased hardness, finer granularity, thermal stability, good adhesion, and low bulk resistivity. Exemplary methods of creating the titanium boronitride include a sputtering process and a plasma anneal process.
申请公布号 US2004201398(A1) 申请公布日期 2004.10.14
申请号 US20040835014 申请日期 2004.04.29
申请人 HU YUNGJUN JEFF 发明人 HU YUNGJUN JEFF
分类号 G01R31/02;G01R31/28;H01L21/768;H01L23/485;H01L23/532;H01L23/58;(IPC1-7):G01R31/26 主分类号 G01R31/02
代理机构 代理人
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