| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent or control delamination of a resin layer in a semiconductor wafer, a semiconductor device and its manufacturing process, a circuit board and an electronic apparatus. <P>SOLUTION: The semiconductor device has a semiconductor chip 40 in which an integrated circuit 12 and wiring for electrical connection with the integrated circuit 12 are formed and including a pad 16, i.e. part of the wiring, on the surface. The semiconductor device comprises a rewiring layer 22 connected electrically with the pad 16, an external terminal 26 provided above the rewiring layer 22 while being connected electrically therewith, and a resin layer 30 provided to reach the side face of the semiconductor chip 40 while surrounding the external terminal 26. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
