PACKAGE FOR PIEZOELECTRIC DEVICE, PIEZOELECTRIC DEVICE AND THEIR MANUFACTURING METHOD, MOBILE TELEPHONE EMPLOYING THE PIEZOELECTRIC DEVICE, AND ELECTRONIC EQUIPMENT EMPLOYING THE PIEZOELECTRIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a piezoelectric device capable of achieving low height of a product by preventing bad influence of a reflow process in packaging and its package, and to provide a method of manufacturing the piezoelectric device, and a mobile telephone and electronic equipment employing the piezoelectric device.

SOLUTION: The package in which at least one part of it is formed of a ceramic material has a package body 36 for forming an inner space for hermetically housing a piezoelectric resonator piece in the inside by being hermetically sealed with a cover, and electrode portions 31, 31 formed on the inner bottom of one end side of the package body and used for joining the piezoelectric resonator piece 32. A through hole 45 for communicating the outside to the inner space is formed on a side face of the package body 36 or the cover 39.

COPYRIGHT: (C)2005,JPO&NCIPI