| 摘要 |
PROBLEM TO BE SOLVED: To provide a new bisphenol compound, when used as a raw material for thermoplastic plastics such as polycarbonate and polyalylate, expectable of having more increased water-resistance and, thereby, more increased electric characters than those of conventionals and, when used as a raw material for thermosetting resins such as epoxy resin, expectable of having increased impact resistance and flexibility such as bending resistance. SOLUTION: The bisphenol compound is represented by general formula I. Wherein, two isopropylidene groups are mutually bound at meta or para positions based on the phenylene group. COPYRIGHT: (C)2005,JPO&NCIPI
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