| 发明名称 |
SOLDER REFLOW OVEN |
| 摘要 |
A solder reflow oven comprises a reflow zone for heating a workpiece using heated air to a temperature effective to reflow solder. The reflow zone comprises a nozzle having divergent vanes that direct shear layers into neighboring zones to extend the distance over which the workpiece is heated to effective solder reflow temperatures.
|
| 申请公布号 |
US2004200877(A1) |
申请公布日期 |
2004.10.14 |
| 申请号 |
US20030410081 |
申请日期 |
2003.04.09 |
| 申请人 |
VISTEON GLOBAL TECHNOLOGIES, INC. |
发明人 |
GOENKA LAKHI NANDLAL |
| 分类号 |
B23K1/008;A21B1/00;B23K1/00;B23K3/04;B23K101/42;F27B9/00;F27B9/10;F27B9/24;F27B9/36;F27B17/00;F27D5/00;F27D9/00;F27D11/00;H05K3/34;(IPC1-7):B23K1/00 |
主分类号 |
B23K1/008 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
