发明名称 CERAMIC WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a ceramic wiring board which contains a highly accurate capacitor at a high capacitance and a low inductance by effectively suppressing the thickness unevenness of a dielectric layer and to prove a method for manufacturing the same. <P>SOLUTION: The ceramic wiring board 1 includes wiring layers each 3 made of a metallized conductor formed by sintering a metal powder, and capacitor electrode layers 4 opposed via a plurality of insulating layers 2a-2d each made of ceramics in an insulating base 2 made by laminating the plurality of insulating layers 2a-2d. The insulating layers 2a-2d each is made by sintering a ceramic green sheet 10 made of an inorganic powder of 100 mass pts. and a binder made of a polyvinylpyrrolidone having a weight-average molecular weight of 100,000 to 500,000 of 8 to 20 mass pts. The ceramic green sheet 10 (insulating layer) can be thinned without bringing about a thickness unevenness, and the ceramic wiring board containing a capacitor having a high capacitance/high accuracy can be obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004288663(A) 申请公布日期 2004.10.14
申请号 JP20030049432 申请日期 2003.02.26
申请人 KYOCERA CORP 发明人 IKEGAMI HIROSHIGE
分类号 C04B35/622;C04B35/632;H01L23/12;H05K3/46 主分类号 C04B35/622
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