SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the connection reliability in three-dimensional mounting under the consideration of package bending.

SOLUTION: The aperture diameters of openings 13a and 13b respectively formed corresponding to projecting electrodes 29a and 29b are set so as to be gradually reduced from the central part to outer peripheral part of a carrier substrate 11, and the aperture diameters of openings 22a and 22b formed corresponding to the projecting electrodes 29a and 29b are set so as to be gradually reduced from the central part to outer peripheral part of a carrier substrate 21.

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