发明名称 WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board which can enhance a packaging density and which can easily change the wiring destination of a wiring pattern. <P>SOLUTION: The wiring board includes a board body 10 in which wiring patterns 16, 17a and a hole 20 are formed, and a wiring body 30 detachably mounted in the hole 20 of the board body 10. The wiring body 30 has a columnar body part 31 and a protrusion part 32 formed on the outer peripheral surface of the upper part of the body 31. The hole 20 is formed of a cylindrical hole 21 and a cutout 22 communicating with the end of this cylindrical hole 21 merged into a wiring body shape. When the wiring body 30 is press injected into the hole 20, the terminals 36, 37 of a wiring circuit 35 formed on the wiring body 30 are respectively brought into contact with the wiring patterns 16, 17a of the board. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004288995(A) 申请公布日期 2004.10.14
申请号 JP20030081075 申请日期 2003.03.24
申请人 SEIKO EPSON CORP 发明人 SHIMADA KAZUNOBU
分类号 H05K1/18;H05K3/46;(IPC1-7):H05K1/18 主分类号 H05K1/18
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