| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of testing a semiconductor device which is capable of testing the electrical properties of the semiconductor device with high accuracy before an assembly process is carried out. SOLUTION: The method of testing the semiconductor device 20 comprises processes of positioning a semiconductor wafer where the semiconductor devices 20 have been formed on the surface of a test jig 1, separating the semiconductor wafer into a plurality of semiconductor chips 28 on the surface of the test jig 1 by cutting off the semiconductor wafer, and testing the electrical properties of the semiconductor device 20 formed on each of the semiconductor chips 28 while the semiconductor chips 28 are positioned on the surface of the testing jig 1. COPYRIGHT: (C)2005,JPO&NCIPI |
