发明名称 TAPE CARRIER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To resolve the problem that fine pitch connection is difficult in a conventional tape carrier substrate wherein a plurality of electrodes formed on a resin film are parallel each other and therefore resin between electrodes elongates when the resin film absorbs moisture and an electrode interval is larger than a prescribed dimension. SOLUTION: The resin film 2 is restrained from elongating when it absorbs humidity by disposing a plurality of electrodes 3 on the resin film 2 in a line to form parallel lines and by forming a conductor 4 parallel to the line of the plurality of formed electrodes 3 wider than the electrode line. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004289054(A) 申请公布日期 2004.10.14
申请号 JP20030082054 申请日期 2003.03.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 TOSHIDA KENJI;HAMAGUCHI TSUNEO;TATEISHI TORU
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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