WIRING BOARD AND ITS MANUFACTURING PROCESS, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To improve the degree of freedom in designing of a wiring board. SOLUTION: The wiring board comprises a bendable flexible board 10, a wiring pattern 20 formed on the flexible board 10 and having a plurality of wirings 21 and a plurality of lands wider than the wirings 21, and a wire 30 for electrically connecting a first land 22 among the plurality of lands and a second land 26 located remotely from the first land 22. COPYRIGHT: (C)2005,JPO&NCIPI