| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic part which can efficiently produce the electronic part of a stable quality and to provide a method for manufacturing an electronic parts assembly. SOLUTION: In the method for manufacturing the electronic part in individual pieces by dividing a semiconductor wafer from which a plurality of chips 3 are formed, the semiconductor wafer adhered to a dicing sheet is diced and divided into the chips 3 of the individual pieces, the chips 3 of the individual pieces are temporarily held simultaneously together with the dicing sheet with a holding sheet 5. Then these chips 3 are adhered to a pickup sheet 7 having an interfacial force on the smooth front surface. When supplying, the chip 3 is taken out in each individual piece from the pickup sheet. Thus, suitable holding forces are kept the dicing sheet and the pickup sheet. The stable dicing and the normal pickup are made compatible so that the electronic part can be efficiently produced with a stabilized quality without cracks, cuts, etc. COPYRIGHT: (C)2005,JPO&NCIPI |
