| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic wiring board, in which after forming a metal circuit board on an AlN board that has conventionally been unable to have a metal circuit board formed thereon unless on a surface-by-surface basis, the formed product is divided to realize mass production. SOLUTION: (1) An AlN board of 25 mm in width, 100 mm in length and 0.635 mm in thickness having deflecting strength of 41 kgf/mm<SP>2</SP>provided with parting lines is prepared. (2) On this board, joining paste having a eutectic composition of Ag-Cu doped with 4 weight % of Ti is applied, a copper plate is stacked on the paste, and the copper plate is joined by heat treatment. (3) Unnecessary portions of copper are removed by etching the copper plate surface of the resultant joined piece with ferric chloride solution and a copper circuit is formed. (4) A pressure is manually applied on the obtained board, which is cut along the parting lines. COPYRIGHT: (C)2005,JPO&NCIPI
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