发明名称 LIGHT EMITTING ELEMENT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a light emitting element module which improves its drive circuit or the like in heat dissipating properties so as to control the wavelength of light emitting elements with high accuracy and stability and is improved in assembly properties by easily installing component parts inside a cabinet. SOLUTION: The light emitting element module is equipped with a heat sink installed on the inner bottom of its cabinet, a carrier arranged inside the cabinet, a heat insulating material mounted on the top surface of the carrier, the light emitting elements which are mounted on the top surface of the carrier to emit modulating light for optical communication, a drive circuit board mounted over the heat sink and the heat insulating material, and the drive circuit which is mounted on the drive circuit board to drive the light emitting elements. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004288751(A) 申请公布日期 2004.10.14
申请号 JP20030076620 申请日期 2003.03.19
申请人 NTT ELECTORNICS CORP 发明人 KOBAYASHI KENJI;EBISAWA FUMIHIRO;NISHIZAWA HISAKI
分类号 H01S5/022;H01S5/0687;(IPC1-7):H01S5/022;H01S5/068 主分类号 H01S5/022
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