| 摘要 |
PURPOSE: A semiconductor strip sawing apparatus and a singulation apparatus of a semiconductor package including the same are provided to simplify a total structure and improve a processing speed by integrating a sawing part and a pick and place part within a main body. CONSTITUTION: A semiconductor strip sawing apparatus includes an on-loader unit(110) for supplying a strip, a cutting unit for cutting the strip, and a chuck table for picking up the strip, shifting the strip to the cutting unit, and cutting the strip. The on-loader unit includes an inlet device(120) for carrying selectively the loaded strip to the first and the second positions. The chuck table includes the first chuck table(131) and the second chuck table(132) for transferring alternately the strip and the cut package from the inlet device and the cutting unit.
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