ELECTRONIC CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an electronic circuit device and a manufacturing method thereof by employing a high polymer resin film sheet for a circuit board and mounting electronic components such as an LSI on the board for realizing a light weight, a low profile, and a low cost.

SOLUTION: The electronic circuit device is configured such that an electronic component 15 having connection terminals 16 formed on one side and the circuit board 11 are adhered by an adhesive sheet 13 having through-holes 14, and the connection terminals 16 of the electronic component 15 and the electrode pads 12 provided to the circuit board 11 are connected by conductive adhesive 17 in the through-holes 14. The manufacturing method includes the steps of: positioning the through-holes 14 of the adhesive sheet 13 having the through-holes 14 to the electrode pads 12 provided to the surface of the circuit board 11 to adhere the adhesive sheet 13 to the circuit board 11; applying the conductive adhesive 17 to the through-holes 14; adhering the connection terminals 16 of the electronic component 16 to the electrode pads 12 provided to the circuit board 11 by the conductive adhesive 17 in the through-holes 14; and adhering the electronic component 15 to the adhesive sheet 13.

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